Singulating a PCB Array with a Semiautomatic Air Press
This is the first test cut singulation of a new Depaneling Die for a 36-up PCA (printed circuit board array). The printed circuit board is being singulated, or depaneled from the array using a die in a semiautomatic air press. This die will normally be used with a robotic load/offload. The process is stress free to the PCB components and trace lines. Delicate ceramic capacitors can be as close as 1/2 mm of the die blades. The process is a quick and relatively inexpensive method to separate individual PCBs from a PCA.